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[IEEE IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging - Scottsdale, AZ, USA (23-25 Oct. 2000)] IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) - Interconnect characterization and design optimization for high speed digital applications
Sarfaraz, A., Yuan, C., Haw-Jyh Liaw,, Gong-Jong Yeh,, Kollipara, R.Year:
2000
Language:
english
DOI:
10.1109/epep.2000.895522
File:
PDF, 334 KB
english, 2000