[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Microstructural characterization of electroplating Sn on lead-frame alloys
Wang, Yiqing, Ding, Dongyan, Galuschki, Klaus-Peter, Hu, Yu, Gong, Angela, Bai, Shuo, Li, Ming, Mao, DaliYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270677
File:
PDF, 5.77 MB
english, 2009