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[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - QFN Wire Bond Dilemma - Stress Neck & Stress Heel
Eng, Tan Chee, Jeat, Pan Yen, Fonseka, GealeYear:
2007
Language:
english
DOI:
10.1109/eptc.2007.4469717
File:
PDF, 2.18 MB
english, 2007