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[IEEE 2011 IEEE Symposium on Industrial Electronics and Applications (ISIEA 2011) - Langkawi, Malaysia (2011.09.25-2011.09.28)] 2011 IEEE Symposium on Industrial Electronics and Applications - Outsource bond pad reliability methodology setup for foundry process changes
Ng, Hong SengYear:
2011
Language:
english
DOI:
10.1109/isiea.2011.6108805
File:
PDF, 603 KB
english, 2011