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[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - Finite element simulation of fracture behavior of BGA structure solder interconnects
Hong-Bo, Qin, Bin, Li, Xun-Ping, Li, Xin-Ping, ZhangYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6066995
File:
PDF, 2.78 MB
english, 2011