[IEEE IEEE International Interconnect Technology Conference...

  • Main
  • [IEEE IEEE International Interconnect...

[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Mechanism for early failure in Cu dual damascene structure

Dae-Yong Kim,, Wong, S.S.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219772
File:
PDF, 250 KB
english, 2003
Conversion to is in progress
Conversion to is failed