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[IEEE IEEE International Interconnect Technology Conference - Burlingame, CA, USA (2-4 June 2003)] Proceedings of the IEEE 2003 International Interconnect Technology Conference (Cat. No.03TH8695) - Mechanism for early failure in Cu dual damascene structure
Dae-Yong Kim,, Wong, S.S.Year:
2003
Language:
english
DOI:
10.1109/iitc.2003.1219772
File:
PDF, 250 KB
english, 2003