Microjet cooling devices for thermal management of...

IEEE Transactions on Components and Packaging Technologies 2003 / 06 Vol. 26; Iss. 2

Microjet cooling devices for thermal management of electronics

Kercher, D.S., Jeong-Bong Lee,, Brand, O., Allen, M.G., Glezer, A.
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Volume:
26
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2003.815116
Date:
June, 2003
File:
PDF, 623 KB
english, 2003
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