Processing thick multilevel polyimide films for 3-D stacked...

IEEE Transactions on Advanced Packaging 1999 / 5 Vol. 22; Iss. 2

Processing thick multilevel polyimide films for 3-D stacked memory

Caterer, M.D., Daubenspeck, T.H., Ference, T.G., Holmes, S.J., Quinn, R.M.
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Volume:
22
Language:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.763191
Date:
May, 1999
File:
PDF, 1.69 MB
english, 1999
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