Comprehensive Thermo-Mechanical Stress Analyses and...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 07 Vol. 3; Iss. 7

Comprehensive Thermo-Mechanical Stress Analyses and Underfill Selection of Large Die Flip Chip Ball Grid Array

Hsieh, Ming-Che, Lee, Chien Chen, Hung, Li Chiun
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2012.2232712
Date:
July, 2013
File:
PDF, 1.33 MB
english, 2013
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