[IEEE 2011 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2011) - Incheon, Korea (South) (2011.07.4-2011.07.7)] 18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Numerical analysis and experimental verification of ISC(Integrated Smart Card) during bending and twist test
Jae-Oh Bang,, Hyo-Soo Lee,, Kyong-Jun An,, Seung-Boo Jung,Year:
2011
Language:
english
DOI:
10.1109/ipfa.2011.5992759
File:
PDF, 2.45 MB
english, 2011