[IEEE 2011 IEEE International Symposium on Assembly and...

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[IEEE 2011 IEEE International Symposium on Assembly and Manufacturing (ISAM) - Tampere, Finland (2011.05.25-2011.05.27)] 2011 IEEE International Symposium on Assembly and Manufacturing (ISAM) - 3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier

Pfeffer, Michael, Goth, Christian, Craiovan, Daniel, Franke, Jorg
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Year:
2011
Language:
english
DOI:
10.1109/isam.2011.5942362
File:
PDF, 941 KB
english, 2011
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