![](/img/cover-not-exists.png)
[IEEE 2011 IEEE International Symposium on Assembly and Manufacturing (ISAM) - Tampere, Finland (2011.05.25-2011.05.27)] 2011 IEEE International Symposium on Assembly and Manufacturing (ISAM) - 3D-Assembly of Molded Interconnect Devices with standard SMD pick & place machines using an active multi axis workpiece carrier
Pfeffer, Michael, Goth, Christian, Craiovan, Daniel, Franke, JorgYear:
2011
Language:
english
DOI:
10.1109/isam.2011.5942362
File:
PDF, 941 KB
english, 2011