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[IEEE 2013 IEEE International Reliability Physics Symposium (IRPS) - Anaheim, CA (2013.4.14-2013.4.18)] 2013 IEEE International Reliability Physics Symposium (IRPS) - Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects
Hauschildt, M., Hennesthal, C., Talut, G., Aubel, O., Gall, M., Yeap, K. B., Zschech, E.Year:
2013
Language:
english
DOI:
10.1109/irps.2013.6531951
File:
PDF, 475 KB
english, 2013