[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Dissolution behavior of Cu UBM in BGA structure Sn-3.0Ag-0.5Cu/Cu joints during liquid isothermal aging at and above the solder's melting temperature

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