[IEEE 2014 15th International Conference on Electronic...

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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Preparation of direct plated copper ceramic spreader using electroless copper as seed layer

Hao, Ziliang, Zhang, Xuebin, Chen, Chen, Chen, Mingxiang
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Year:
2014
DOI:
10.1109/ICEPT.2014.6922657
File:
PDF, 342 KB
2014
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