[IEEE 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (8-12 July 2002)] Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614) - Reliability of copper dual damascene influenced by pre-clean
Tokei, Zs., Lanckmans, F., Van den bosch, G., Van Hove, M., Maex, K., Bender, H., Hens, S., Van Landuyt, J.Year:
2002
Language:
english
DOI:
10.1109/ipfa.2002.1025629
File:
PDF, 914 KB
english, 2002