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[IEEE 2009 IEEE International Symposium on Electromagnetic Compatibility - EMC 2009 - Austin, TX, USA (2009.08.17-2009.08.21)] 2009 IEEE International Symposium on Electromagnetic Compatibility - An investigation of the effect of grounding pads on power bus resonance characteristics
Morishita, Ken, Hubing, Todd, He, Xinbo, Kobayashi, Naoki, Harada, TakashiYear:
2009
Language:
english
DOI:
10.1109/isemc.2009.5284693
File:
PDF, 1.21 MB
english, 2009