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[IEEE 2010 International Symposium on Advanced Packaging Materials: Microtech (APM) - Cambridge, United Kingdom (2010.02.28-2010.03.2)] 2010 International Symposium on Advanced Packaging Materials: Microtech (APM) - Reliability study for high temperature stable conductive adhesives
Wenkai Tao,, Si Chen,, Berggren, Par, Liu, JohanYear:
2010
Language:
english
DOI:
10.1109/isapm.2010.5441378
File:
PDF, 1.96 MB
english, 2010