[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer
Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, PinjalaYear:
2009
Language:
english
DOI:
10.1109/eptc.2009.5416505
File:
PDF, 1.91 MB
english, 2009