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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - On model fitting methods for modeling polymer cure kinetics in microelectronics assembly applications
Tilford, T., Morris, J. E., Ferenets, M., Rajaguru, P. R., Pavuluri, S. K., Desmulliez, M. P. Y., Bailey, C.Year:
2010
Language:
english
DOI:
10.1109/ESTC.2010.5642820
File:
PDF, 771 KB
english, 2010