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[IEEE 2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Hsinchu (2013.4.22-2013.4.24)] 2013 International Symposium on VLSI Technology, Systems and Application (VLSI-TSA) - Co-sputtered Cu/Ti bonded interconnects for 3D integration applications
Hsiao-Yu Chen,, Sheng-Yao Hsu,, Kuan-Neng Chen,Year:
2013
Language:
english
DOI:
10.1109/vlsi-tsa.2013.6545619
File:
PDF, 713 KB
english, 2013