Electrical–Thermal Cosimulation With...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 4 Vol. 4; Iss. 4

Electrical–Thermal Cosimulation With Nonconformal Domain Decomposition Method for Multiscale 3-D Integrated Systems

Xie, Jianyong, Swaminathan, Madhavan
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2286403
Date:
April, 2014
File:
PDF, 5.28 MB
english, 2014
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