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[IEEE 2007 IEEE International Interconnect Technology Conferencee - Burlingame, CA, USA (2007.06.4-2007.06.6)] 2007 IEEE International Interconnect Technology Conferencee - Mechanistic Study of Plasma Damage and CH4 Recovery of Low k Dielectric Surface
Bao, J. J., Shi, H. L., Liu, J. J., Huang, H., Ho, P.S., Goodner, M. D., Moinpour, M., Kloster, G. M.Year:
2007
Language:
english
DOI:
10.1109/iitc.2007.382366
File:
PDF, 575 KB
english, 2007