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[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene
Waeterloos, J.J., Shaffer, E.O., Stokich, T., Hetzner, J., Price, D., Booms, L., Donaton, R.A., Beyer, G., Coenegrachts, B., Caluwaerts, R., Struyf, H., Tokei, Z.S., Vervoort, I., Sijmus, B., Vos, I.,Year:
2001
Language:
english
DOI:
10.1109/iitc.2001.930017
File:
PDF, 279 KB
english, 2001