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[IEEE 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Atlanta, GA, USA (15-17 March 2006)] 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface - Electrochemical migration control of silver-paste conductive adhesives
Yi Li,, Kyoung-sik Moon,, Wong, C.P.Year:
2006
Language:
english
DOI:
10.1109/isapm.2006.1666001
File:
PDF, 475 KB
english, 2006