[IEEE 2007 IEEE Ultrasonics Symposium Proceedings - New York, NY, USA (2007.10.28-2007.10.31)] 2007 IEEE Ultrasonics Symposium Proceedings - 2E-2 0806 SAW Filters Using Wafer Level Packaging Technology
Fukano, T., Okubo, Y., Nishii, J., Obara, I.Year:
2007
Language:
english
DOI:
10.1109/ultsym.2007.30
File:
PDF, 392 KB
english, 2007