![](/img/cover-not-exists.png)
[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Effects of bump metallurgies, underfill material and its cure process on package warpage
Zhang, Jieping, Dongwen Gan,, Jinlin Wang,, Jayaraman Saikumar,, Li-Hsin Chang,Year:
2010
Language:
english
DOI:
10.1109/icept.2010.5582342
File:
PDF, 665 KB
english, 2010