Development of Package-on-Package Using Embedded...

IEEE Transactions on Components Packaging and Manufacturing Technology 2013 / 10 Vol. 3; Iss. 10

Development of Package-on-Package Using Embedded Wafer-Level Package Approach

Chong, Ser Choong, Wee, David Ho Soon, Rao, Vempati Srinivasa, Vasarla, Nagendra Sekhar
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Volume:
3
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2013.2275009
Date:
October, 2013
File:
PDF, 1.97 MB
english, 2013
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