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[IEEE 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Portland, OR, USA (2006.08.14-2006.08.18)] 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006. - Signal integrity constrained optimization of flexible printed interconnects for mobile devices
Grivet-Talocia, S., Acquadro, S., Bandinu, M., Canavero, F.G., Kelander, I., Rouvala, M.Year:
2006
Language:
english
DOI:
10.1109/isemc.2006.1706388
File:
PDF, 1.31 MB
english, 2006