[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Copper wire bonding challenges and solutions of small outline packages
Lin, Nicole, Tan, CE, Pan, YJYear:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702709
File:
PDF, 1.97 MB
english, 2010