Tunable Peeling Technique and Mechanism of Thin Chip From...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 4 Vol. 4; Iss. 4

Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes

Liu, Zunxu, Huang, YongAn, Chen, Jiankui, Yin, Zhouping
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Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2298036
Date:
April, 2014
File:
PDF, 1.51 MB
english, 2014
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