[IEEE EuroSimE 2005. 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Berlin, Germany (April 18-20, 2005)] EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. - Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages