[IEEE High Density Packaging (ICEPT-HDP) - Shanghai, China (2011.08.8-2011.08.11)] 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging - TEM study on the Cu wire stitch bonding interface
Liu, Xingjie, Wang, Techun, Cong, Yuqi, Wang, JiajiYear:
2011
Language:
english
DOI:
10.1109/icept.2011.6067000
File:
PDF, 1.53 MB
english, 2011