[IEEE 2010 5th International Microsystems, Packaging,...

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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - A low cost rigid-flex opto-electrical link for mobile devices

Huang, Sheng-Ho, Lee, Chun-Hsing, Hu, Hung-Lien, Chu, Mu-Tao, Yeh, Jen-Hao, Chen, Yuan-Chin, Huang, Yu-Ming, Hsu, Chao-Kai, Chang, Hsiang-Hung, Fu, Huan-Chun
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Year:
2010
Language:
english
DOI:
10.1109/impact.2010.5699625
File:
PDF, 408 KB
english, 2010
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