[IEEE 2008 International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2008.06.1-2008.06.4)] 2008 International Interconnect Technology Conference - Analytical Study of leakage characteristics change during multilevel interconnect process using porogen-type porous SiOC (k=2.4)/Cu system
Ohashi, N., Nakahira, J., Soda, E., Tomioka, K., Chikaki, S., Oda, N., Kondo, S., Saito, S.Year:
2008
Language:
english
DOI:
10.1109/iitc.2008.4546925
File:
PDF, 443 KB
english, 2008