[IEEE 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Austin, TX, USA (2010.10.25-2010.10.27)] 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems - AC operation of high performance glass ceramic package interconnect and impact on manufacturing
Baez, Franklin M., Spring, Christopher, Lafontant, GaryYear:
2010
Language:
english
DOI:
10.1109/epeps.2010.5642792
File:
PDF, 662 KB
english, 2010