[IEEE 2014 15th International Conference on Thermal,...

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules

Wright, A., Hutzler, A., Schletz, A., Pichler, P.

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Year:

2014

Language:

english

DOI:

10.1109/eurosime.2014.6813813

File:

PDF, 1.45 MB

english, 2014

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