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[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules
Wright, A., Hutzler, A., Schletz, A., Pichler, P.Year:
2014
Language:
english
DOI:
10.1109/eurosime.2014.6813813
File:
PDF, 1.45 MB
english, 2014