[IEEE 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Orlando, FL, USA (2014.5.27-2014.5.30)] Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal performance and reliability characterization of bonded interface materials (BIMs)
DeVoto, Douglas, Paret, Paul, Mihalic, Mark, Narumanchi, Sreekant, Bar-Cohen, Avram, Matin, KaiserYear:
2014
Language:
english
DOI:
10.1109/ITHERM.2014.6892310
File:
PDF, 1.05 MB
english, 2014