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[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Optimal design of drop impact for TFBGA by concept of average stress within finite grid region
Rong-Sheng Chen,, Ray-Wen Wu,, Wen-Chi Liao,Year:
2010
Language:
english
DOI:
10.1109/eptc.2010.5702747
File:
PDF, 2.42 MB
english, 2010