Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation
Guo, Y., Lim, C. K., Chen, W. T., Woychik, C. G.Volume:
37
Language:
english
Journal:
IBM Journal of Research and Development
DOI:
10.1147/rd.375.0635
Date:
September, 1993
File:
PDF, 1.40 MB
english, 1993