IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1998 / 3 Vol. 21; Iss. 1
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Transient thermal management of portable electronics using heat storage and dynamic power dissipation control
Lipeng Cao,, Krusius, J.P., Korhonen, M.A., Fisher, T.S.Volume:
21
Language:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.679040
Date:
March, 1998
File:
PDF, 252 KB
english, 1998