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[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - The reliability evaluation of (PTH hole) negative wetting phenomena in lead free process used OSP coated PCB by using thermal cycle testing
Liao, Meng-Chieh, Chen, Arch, Huang, Tzeng-Cherng, Luo, Te-ChunYear:
2010
Language:
english
DOI:
10.1109/impact.2010.5699541
File:
PDF, 334 KB
english, 2010