![](/img/cover-not-exists.png)
[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
Sakuma, Katsuyuki, Blackshear, Edmund, Tunga, Krishna, Lian, Chenzhou, Li, Shidong, Interrante, Marcus, Mantilla, Oswald, Nah, Jae-WoongYear:
2013
Language:
english
DOI:
10.1109/ectc.2013.6575645
File:
PDF, 1.00 MB
english, 2013