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[IEEE 2010 3rd Electronic System-Integration Technology Conference (ESTC) - Berlin, Germany (2010.09.13-2010.09.16)] 3rd Electronics System Integration Technology Conference ESTC - Process integration of fine pitch micro-bumping and Cu redistribution wiring for power efficient SiP
Ezawa, Hirokazu, Togasaki, Takashi, Migita, Tatsuo, Yamashita, Soichi, Inohara, Masahiro, Koshio, Yasuhiro, Fukuda, Masatoshi, Miyata, Masahiro, Nagamine, Koro, Iijima, TadashiYear:
2010
Language:
english
DOI:
10.1109/estc.2010.5642887
File:
PDF, 2.11 MB
english, 2010