[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Bordeaux, France (2010.04.26-2010.04.28)] 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - Thermo-mechanical simulations of RF-MEMS 0-level package based on wafer bonding by soldering
Bouwstra, Siebe, Hageman, RemcoYear:
2010
Language:
english
DOI:
10.1109/esime.2010.5464581
File:
PDF, 23.13 MB
english, 2010