[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - The Reliability of Isotropically Conductive Adhesive as Solder Replacement — a Case Study Using LCP Substrate
Kuusiluoma, S., Kiilunen, J.Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614503
File:
PDF, 4.91 MB
english, 2005