[IEEE 2005 7th Electronic Packaging Technology Conference -...

  • Main
  • [IEEE 2005 7th Electronic Packaging...

[IEEE 2005 7th Electronic Packaging Technology Conference - Singapore (07-09 Dec. 2005)] 2005 7th Electronic Packaging Technology Conference - The Reliability of Isotropically Conductive Adhesive as Solder Replacement — a Case Study Using LCP Substrate

Kuusiluoma, S., Kiilunen, J.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
2
Year:
2005
Language:
english
DOI:
10.1109/eptc.2005.1614503
File:
PDF, 4.91 MB
english, 2005
Conversion to is in progress
Conversion to is failed