[IEEE 2013 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2013.11.11-2013.11.13)] 2013 3rd IEEE CPMT Symposium Japan - Microstructural control of electrically conductive adhesives with Ag micro-fillers by binder chemistry
Inoue, Masahiro, Tada, Yasunori, Muta, Hiroaki, Yamanaka, ShinsukeYear:
2013
Language:
english
DOI:
10.1109/icsj.2013.6756122
File:
PDF, 602 KB
english, 2013