[IEEE 53rd Electronic Components and Technology Conference,...

[IEEE 53rd Electronic Components and Technology Conference, 2003. - New Orleans, Louisiana, USA (May 27-30, 2003)] 53rd Electronic Components and Technology Conference, 2003. Proceedings. - Impact of ingressed moisture and high temperature warpage behavior on the robust assembly capability for large body PBGAs

Shook, R.L., Gilbert, J.J., Thomas, E., Vaccaro, B.T., Dairo, A., Horvath, C., Libricz, G.J., Crouthamel, D.L., Gerlach, D.L.

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Year:

2003

Language:

english

DOI:

10.1109/ectc.2003.1216551

File:

PDF, 452 KB

english, 2003

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