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[IEEE 2010 IEEE International Interconnect Technology Conference - IITC - Burlingame, CA, USA (2010.06.6-2010.06.9)] 2010 IEEE International Interconnect Technology Conference - Robust spin-on glass gap-fill process technology for sub-30nm interlayer dielectrics
Byun, Kyung-Mun, Jung, Deok-Young, Lee, Jun-Won, Lee, Seungheon, Kim, Hyongsoo, Kim, Mun-Jun, Hong, Eunkee, Gang, Mansug, Nam, Seok-Woo, Moon, Joo-Tae, Chung, Chilhee, Lee, Jung-Hoo, Lee, Hyo-SugYear:
2010
Language:
english
DOI:
10.1109/iitc.2010.5510709
File:
PDF, 339 KB
english, 2010