3-D perpendicular assembly of SWNTs for CMOS interconnects

Electronic Materials Letters 2013 / 11 Vol. 9; Iss. 6

3-D perpendicular assembly of SWNTs for CMOS interconnects

Tae-Hoon Kim,Cihan Yilmaz,Sivasubramanian Somu…
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Volume:
9
Language:
english
Journal:
Electronic Materials Letters
DOI:
10.1007/s13391-013-6006-6
Date:
November, 2013
File:
PDF, 368 KB
english, 2013
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