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[IEEE 2008 58th Electronic Components and Technology Conference (ECTC 2008) - Lake Buena Vista, FL, USA (2008.05.27-2008.05.30)] 2008 58th Electronic Components and Technology Conference - High aspect ratio TSV copper filling with different seed layers
Wolf, M. Jurgen, Dretschkow, Thomas, Wunderle, Bernhard, Jurgensen, Nils, Engelmann, Gunter, Ehrmann, Oswin, Uhlig, Albrecht, Michel, Bernd, Reichl, HerbertYear:
2008
Language:
english
DOI:
10.1109/ectc.2008.4550029
File:
PDF, 3.44 MB
english, 2008